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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
July 29, 2014
SAMP-Based Stencil Nano Coatings
SAMP-Based Stencil Nano Coatings
Analysis Lab
Profiled Squeegee Blade Review
Profiled Squeegee Blade Review
Production Floor
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Production Floor
Type III vs. Type IV Solder Paste
Type III vs. Type IV Solder Paste
Ask the Experts
Screen Print Stepped Stencil Review
Screen Print Stepped Stencil Review
Board Talk
Effect of Nano-Coated Stencil on 01005 Printing
Effect of Nano-Coated Stencil on 01005 Printing
Production Floor
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
Low Surface Energy Coatings Rewrite Area Ratio Rules
Low Surface Energy Coatings Rewrite Area Ratio Rules
Materials Tech
Printing vs. Dispensing
Printing vs. Dispensing
Board Talk
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Board Talk
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Trends Audio Magazine

Screen Printing and Humidity
Screen Printing and Humidity
Solder paste is drying out inside our screen printer. How can we increase humidity inside our screen printer to slow drying of our solder paste?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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