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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
April 17, 2014
Most Important Factors for Screen Printing
Most Important Factors for Screen Printing
Ask the Experts
Minimizing Voiding in QFN Packages
Minimizing Voiding in QFN Packages
Production Floor
Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
Production Floor
How to Clamp Odd Shaped Circuit Boards
How to Clamp Odd Shaped Circuit Boards
Ask the Experts
Components Near PCB Edges
Components Near PCB Edges
Board Talk
Low-Silver BGA Assembly
Low-Silver BGA Assembly
Production Floor
Controlling the Assembly Process Using SPC
Controlling the Assembly Process Using SPC
Supply Chain
Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
Board Talk
Choosing the Right Stencil Options
Choosing the Right Stencil Options
Production Floor
Chip Component Cracking During Pick/Place
Chip Component Cracking During Pick/Place
Board Talk
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Select the best plastic for DDR4 housings
Select the best plastic for DDR4 housings
DSM presents a benchmark between various high performance materials for DDR4 housings. Download the paper and select the best material for DDR4.
DSM Engineering Plastics B.V.

Screen Printing and Humidity
Screen Printing and Humidity
Solder paste is drying out inside our screen printer. How can we increase humidity inside our screen printer to slow drying of our solder paste?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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