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May 24, 2013
Voiding Control at QFN Assembly
Voiding Control at QFN Assembly
Analysis Lab
Integrated Electrical Test Within the Production Line
Integrated Electrical Test Within the Production Line
Production Floor
X-rays vs. Cross Sections to Measure Voids
X-rays vs. Cross Sections to Measure Voids
Analysis Lab
Fatigue Behaviour of Reflowed Joints
Fatigue Behaviour of Reflowed Joints
Analysis Lab
Evaluating Surface Cleanliness
Evaluating Surface Cleanliness
Analysis Lab
Boundary Scan Advanced Diagnostic Methods
Boundary Scan Advanced Diagnostic Methods
Production Floor
Pb-Free Thermal Cycle Acceleration Factors
Pb-Free Thermal Cycle Acceleration Factors
Analysis Lab
Revolutionary Technique for Microvia Microsections
Revolutionary Technique for Microvia Microsections
Analysis Lab
Explanation of PoP Inspection Techniques
Explanation of PoP Inspection Techniques
Analysis Lab
Drop Test Performance of BGA Assemblies
Drop Test Performance of BGA Assemblies
Analysis Lab
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Mechanical Failures in Pb-Free Processing
Mechanical Failures in Pb-Free Processing
This paper covers evaluating the effect of pad crater defects on process strain limits for BGA devices. Methods, results, analysis and mitigation techniques are discussed.
Authored By:
John McMahon
Brian Gray
Celestica Inc.
Toronto, ON, Canada
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