IPC OUTLOOK Logo
The Knowledge and Know-how Connection
IPC OUTLOOK Logo
April 15, 2014
Pin-in-Paste Calculations
Pin-in-Paste Calculations
Board Talk
Lead-free Reflow and Influence of Moisture
Lead-free Reflow and Influence of Moisture
Analysis Lab
What Causes Chip Blow Off During Reflow?
What Causes Chip Blow Off During Reflow?
Board Talk
LGA/QFN Packages Floating During Reflow
LGA/QFN Packages Floating During Reflow
Analysis Lab
Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board Talk
Vapor Phase Quality Improvement
Vapor Phase Quality Improvement
Production Floor
Tips When Moving a Reflow Oven
Tips When Moving a Reflow Oven
Board Talk
Solder Bridging on BGAs
Solder Bridging on BGAs
Ask the Experts
Void-Free Soldering With Vapor-Phase Vacuum Tech
Void-Free Soldering With Vapor-Phase Vacuum Tech
Production Floor
How Many Zones Needed for Lead-free Profile?
How Many Zones Needed for Lead-free Profile?
Ask the Experts
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High Temperature Reflow Soldering
High Temperature Reflow Soldering
We use a RoHS BGA that states it is recommended to apply a soldering temperature higher than 250 C. Could we use vapor-phase system for this part?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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