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The Knowledge and Know-how Connection
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May 22, 2013
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We use a RoHS BGA that states it is recommended to apply a soldering temperature higher than 250 C. Could we use vapor-phase system for this part?
Board Talk is presented by ITM ConsultingVisit ITM Consulting to learn more.Phil Zarrow, ITM ConsultingWith over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes. Jim Hall, ITM ConsultingA Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Views: 1446
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You guys are quite a duo. The peak temperatures being seen by many smaller parts on complex cards are in the order of 250-260 deg C when lead free alloys are being used and convection is the process of choice. The component manufacturers are probably happy with it, but as an industry we live with it because the predominant convection reflow technology cannot isolate the thermal characteristics of the process and keep the lower mass parts cooler - so they ramp faster and to a higher peak.
260c is an off the shelf VP fluid. But the more important point is that like all Vapor Phase Fluids - this is a MAX, not a desired point of process heating being terminated. Show me that in a convection oven.
Allen Duck, A-Tek llc.
Gentlemen, when it comes to vapor phase, Solvay Solexis offers the Galden HS260 with a boiling point/vapor temp of 260 C. This fluid is used regularly for circuit boards in the oil exploration down hole industry as well as several others.
David Suihkonen, R&D Technical Services