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February 9, 2012
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Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering ...
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More Analysis Lab  » 		New High-speed Modular Chip-shooter
New High-speed Modular Chip-shooter
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems

Head-On-Pillow Defect - A Pain in the Neck *
Head-On-Pillow Defect - A Pain in the Neck *
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with.
Authored By:
Chris Oliphant, Bev Christian, Kishore Subba-Rao, Fintan Doyle, Laura Turbini, David Connell, Jack Q. L. Han
Research In Motion, Waterloo, Ontario, Canada
This program first published September 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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