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February 9, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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Lifted Leads on QFP Components
Lifted Leads on QFP Components
After placement and reflow, we are having a random lifted lead problem on some QFP's. Is a 1% fall out rate normal? What might be the cause?
This program first published September 2010
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Bob Black, President and CEO, Juki Corporation
Allen W. Duck, CEO, ATEK llc
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Neil Poole, Senior Applications Chemist, Henkel Electronics
Harold Hyman, Consultant, VJ Electronix
Paul J. Koep, Global Product Manager, Alpha - Cookson Electronics
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