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PCBs are MSDs
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Assembly of Fine Pitch PoP Components
Paper focuses different assembly variations for PoP components with .4 mm pitch on the lower package and .5mm pitch on the upper package.
Authored By:
Heather McCormick, Jimmy Chow
Celestica Inc.
Toronto, ON, Canada
Lee Smith, Ahmer Syed, Corey Reichman, CJ Berry
Amkor Technology Inc.
Chandler, AZ, USA
This program first published August 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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