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Design for Assembly of 01005 Components
Paper covers stencil types, aperture designs, pad layouts and process settings to achieve high-yield assembly for 01005 components.
Authored By:
J. Li, S. Poranki, K. Srihari, Ph.D.
Watson Institute for Systems Excellence
State University of New York
Binghamton, NY, USA
R. Gallardo, M. Abtew, R. Kinyanjui, Ph.D.
Technology Development Center
Sanmina-SCI Corporation
San Jose, CA, USA
This program first published August 2010
Materials Tech programs cover topics including: Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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The Design Process Just Got Easier
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