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February 9, 2012
Improve Scheduling in Electronics Assembly
Supply Chain
Solder Paste and the 5 Ball Rule
Board Talk
Past, Present, Future of Solderless Assembly
Production Floor
Optimization to Prevent the Graping Effect
Production Floor
Stencil Manufacturing and Impact on Precision
Production Floor
Plating Lead-free Parts for Tin/Lead Assembly
Ask the Experts
A Robust Fine Feature Printing Process
Production Floor
When Is It Time to Replace a Squeegee or Stencil?
Board Talk
Pick and Place to Insert Radial Lead Devices
Board Talk
Optimizing Print Process for Mixed Technology
Production Floor
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Design for Assembly of 01005 Components
Design for Assembly of 01005 Components
Paper covers stencil types, aperture designs, pad layouts and process settings to achieve high-yield assembly for 01005 components.
Authored By:
J. Li, S. Poranki, K. Srihari, Ph.D.
Watson Institute for Systems Excellence
State University of New York
Binghamton, NY, USA

R. Gallardo, M. Abtew, R. Kinyanjui, Ph.D.
Technology Development Center
Sanmina-SCI Corporation
San Jose, CA, USA
This program first published August 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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