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February 9, 2012
Epoxy Bonding Problems on RoHS Boards
Ask the Experts
Shelf Life Before Conformal Coating
Board Talk
Four Techniques for Removing Solder Mask
Production Floor
Alternatives to Conformal Coating
Ask the Experts
Conformal Coating for Tin Whisker Management
Materials Tech
Problems with Bubbles in Conformal Coating
Ask the Experts
Contamination Prior to Conformal Coating
Ask the Experts
Measuring Conformal Coating Adhesion
Materials Tech
Can Conductive Epoxies Replace Solder?
Board Talk
Do We Still Need SMT Adhesives?
Board Talk
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pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies ...
False Tin Whiskers: Masquerading Intermetallic
Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering ...
Reactions of Sn in the Cu-Sn-Zn Alloy
This paper reports a number of experimentally determined reactions that occur in ...
Embedded Components: Analysis of Reliability
Paper aims at analyzing and confirming the reliability performance of embedded components ...
Lead-free Reflow and Influence of Moisture
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Thermal Cycle Testing of PWBs
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Void Detection in Solder Balls and Joints
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Addressing Head-In-Pillow Defects
The head-in-pillow defect has become a relatively common failure since the implementation ...
Thermal Shock/Drop Test of Lead-free
Paper has results from experimental research making a comparison of different lead-free ...
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More Analysis Lab  »
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec

Reliability of Coated WLCSP Components
Reliability of Coated WLCSP Components
Paper evaluates coating adhesion and solder joint reliability for assemblies with different conformal coatings, solder masks and underfill.
Authored By:
J. Salminen
Nokia Corporation
Salo, Finland
This program first published August 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
Flux and Under-fill in a Single Material
Flux and Under-fill in a Single Material
This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
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Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
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