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February 9, 2012
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Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.

Stencil Design Improves Drop Test Performance
Stencil Design Improves Drop Test Performance
Paper evaluates the influence of stencil printed solder volume on electronic component lifetime in mechanical stress testing.
Authored By:
Jeff Schake
DEK USA, Rolling Meadows, IL USA

Brian Roggeman
Universal Instruments Corp., Conklin, NY USA
This program first published August 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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