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February 9, 2012
Thermal Cycle Testing of PWBs
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Fighting Undesirable Effects of Thermal Cycling
Fighting Undesirable Effects of Thermal Cycling
This paper discloses features to enhance the performance of column-like solder joints to improve reliability of electronic assemblies.
Authored By:
Gabe Cherian
Cherian LLC
Sun Valley, Idaho USA
This program first published August 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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MSD Damage Causes Early Field Failures
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