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February 9, 2012
Improve Scheduling in Electronics Assembly
Supply Chain
Solder Paste and the 5 Ball Rule
Board Talk
Past, Present, Future of Solderless Assembly
Production Floor
Optimization to Prevent the Graping Effect
Production Floor
Stencil Manufacturing and Impact on Precision
Production Floor
Plating Lead-free Parts for Tin/Lead Assembly
Ask the Experts
A Robust Fine Feature Printing Process
Production Floor
When Is It Time to Replace a Squeegee or Stencil?
Board Talk
Pick and Place to Insert Radial Lead Devices
Board Talk
Optimizing Print Process for Mixed Technology
Production Floor
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Effect of Clamping Systems on Print Quality
Effect of Clamping Systems on Print Quality
Paper investigates the effect of top clamp and Y-snugger on a specially designed test stencil and production quality cell phone boards.
Authored By:
Dr. Rita Mohanty
Speedline Technologies
Franklin MA USA

Rajiv L. Iyer, Daryl Santos
Binghamton University
Binghamton, NY USA
This program first published August 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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Effect of Clamping Systems on Print Quality

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