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February 9, 2012
pH Neutral vs. Alkaline Cleaning Agents
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Ultrasonic Cleaning Causing Damage
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Removing Flux from Low Standoff Heights
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Organic Flux Residue Concerns
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Is Baking Required After Water Cleaning?
Board Talk
How Clean is Clean?
Production Floor
Cleaning No-Clean Solder Paste
Ask the Experts
Collaborative Cleaning Process Innovations
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Why Switch From Pure DI-Water to Chemistry
Production Floor
Effects of Ultrasonic Cleaning
Ask the Experts
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Cleaning Solder Paste Misprint
Cleaning Solder Paste Misprint
What should we do when we find defects in the solder paste print on the second side. We currently scrap the boards when these defects.
This program first published August 2010
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  »
Use the form below to submit a comment.
We follow IPC-7526 Stencil and Misprinted Board Cleaning Handbook.

We manufactured a fixture to suspend our board with the paste side only touching the chemistry used to clean the solder paste and turn on a ultrasonic system for 4 minutes. We then wash the PCB in our water wash system and prior to releasing the PCB back to production we vacuum bake the board at 60 degree C for 15 minutes to remove any moisture from the board.


Ray Whittier, Sr.SMT Process Engineer, Vicor Corporation - VI Chip Division
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Cleaning Solder Paste Misprint

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