Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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We follow IPC-7526 Stencil and Misprinted Board Cleaning Handbook.
We manufactured a fixture to suspend our board with the paste side only touching the chemistry used to clean the solder paste and turn on a ultrasonic system for 4 minutes. We then wash the PCB in our water wash system and prior to releasing the PCB back to production we vacuum bake the board at 60 degree C for 15 minutes to remove any moisture from the board.
Ray Whittier, Sr.SMT Process Engineer, Vicor Corporation - VI Chip Division
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
Does your equipment supplier stand behind the quality and reliability of their pick & place machines with a 5-year parts / 2-year labor warranty? Learn more... Europlacer
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
Use the form below to submit a comment.
We manufactured a fixture to suspend our board with the paste side only touching the chemistry used to clean the solder paste and turn on a ultrasonic system for 4 minutes. We then wash the PCB in our water wash system and prior to releasing the PCB back to production we vacuum bake the board at 60 degree C for 15 minutes to remove any moisture from the board.
Ray Whittier, Sr.SMT Process Engineer, Vicor Corporation - VI Chip Division