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February 9, 2012
Cleaning Reballed BGA Components
Board Talk
Rework for Lead-Free Mirrored BGA Designs
Production Floor
Is Pre-Bake Required Prior to Rework?
Ask the Experts
BGA Replacement Limit
Ask the Experts
6 Common Mistakes of BGA Rework
Production Floor
Can You Rework Circuits Under a BGA
Ask the Experts
Reworked BGA Bridging at the Corners
Ask the Experts
Delamination Dilemma
Ask the Experts
BGA Re-balling from Lead-free to Tin-lead
Production Floor
Reworking Circuits Under a BGA Component
Ask the Experts
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Reliability Assessment of Reballed BGAs *
Reliability Assessment of Reballed BGAs *
In this paper, SAC305 solder balls were replaced with SnPb solder balls and tested to evaluate the reliability of these reballed components.
Authored By:
J. Li, S. Poranki, K. Srihari, Ph.D.
Watson Institute for Systems Excellence
State University of New York, Binghamton, NY, USA

M. Abtew, R. Kinyanjui, Ph.D.
Technology Development Center
Sanmina-SCI Corporation, San Jose, CA, USA
This program first published August 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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Rigid Flex That is Built to Last
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