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Great News If You Rework BGA Components
Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
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Organic Flux Residue Concerns
What concerns should we have with reliability if we skip cleaning after rework? Our processes will leave organic flux residues on our boards.
This program first published August 2010
Expert Panel contributors for this topic:
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Mike Konrad, President, Aqueous Technologies | |
Jim Williams, Chairman, Polyonics, Inc. | |
Umut Tosun, Application Technology Manager, Zestron America | |
Gregory Arslanian, Global Segment Manager, Air Products & Chemicals, Inc. | |
Mark McMeen, VP Engineering Services, STI Electronics Inc. | |
Steven Adamson, Market Specialist, Nordson ASYMTEK | |
Karthik Vijay, Technical Manager, European Operations, Indium Corp. | |
Phil Kinner, European Sales Manager, PVA Inc | |
Harold Hyman, Consultant, VJ Electronix | |
Chris Palin, European Manager, HumiSeal |
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Today's Sponsor
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IPC Member Spotlight »
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits 
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Featured Sponsors »
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Innovative No-clean, Halide-free Tacky Flux
Multicore TFN700B is a no-clean, halide-free tacky flux formulated to address the challenging requirements of package-on-package applications.
Henkel Corporation
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Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
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Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic 
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Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK
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