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February 9, 2012
pH Neutral vs. Alkaline Cleaning Agents
Analysis Lab
Ultrasonic Cleaning Causing Damage
Ask the Experts
Removing Flux from Low Standoff Heights
Production Floor
Organic Flux Residue Concerns
Ask the Experts
Is Baking Required After Water Cleaning?
Board Talk
How Clean is Clean?
Production Floor
Cleaning No-Clean Solder Paste
Ask the Experts
Collaborative Cleaning Process Innovations
Production Floor
Why Switch From Pure DI-Water to Chemistry
Production Floor
Effects of Ultrasonic Cleaning
Ask the Experts
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Removing Flux from Low Standoff Heights
Paper covers evaluation of cleaning effectiveness of chemistries in removing flux residues ...
Nitrogen Inerting For Lead-Free Wave Soldering
This paper presents a new generation N2 inerting system for wave soldering ...
Rework for Lead-Free Mirrored BGA Designs
Paper covers recommended materials and the hot gas rework process for lead-free ...
Four Techniques for Removing Solder Mask
This program explains four techniques for removing solder mask including grinding, milling, ...
Going Lead Free with Vapor Phase Soldering
Many companies have not found the right solutions to change over to ...
Past, Present, Future of Solderless Assembly
Paper examines some of the solderless assembly methods used over the years, ...
Optimization to Prevent the Graping Effect
This paper will discuss the specific challenge of the Graping Effect and ...
Stencil Manufacturing and Impact on Precision
Stencil positional accuracy is a function of the manufacturing process. This paper ...
A Robust Fine Feature Printing Process
This paper evaluates many fine printing stencil factors that have an increased ...
6 Common Mistakes of BGA Rework
Ball Grid Array rework is one of the most challenging procedures performed ...
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The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits

Relationship Between Via Size and Cleanliness
Relationship Between Via Size and Cleanliness
Paper explores multiple via sizes, approaches to cleaning, and data showing most viable option for producing good product.
Authored By:
Eric Camden
Foresite, Inc., Kokomo, IN USA
This program first published August 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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The Design Process Just Got Easier
The Design Process Just Got Easier
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Compact Reflow Oven with KIC
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Surface Mount and BGA Pad Repair... Really?
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Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how we can do it reliably.
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