IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 9, 2012
Evaluation of Lead-free Solder Pastes
Materials Tech
Reactions of Sn in the Cu-Sn-Zn Alloy
Analysis Lab
Next Generation PoP Pastes
Materials Tech
Does Lead-free Flux Make a Difference?
Ask the Experts
The Digital Solder Paste
Materials Tech
Flux Cored Wire Solder Shelf Life Study
Materials Tech
Thermal Shock/Drop Test of Lead-free
Analysis Lab
Lead-free Development in Server Applications
Materials Tech
What is the Shelf Life of Solder Paste?
Board Talk
Comparison of SAC105 and SAC305 Solders
Materials Tech
More Related Programs  »



Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free ...
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected ...
New Technologies for Ultra Thin Chips
Paper shows different approaches to use ultra-thin chips for new packages with ...
Design of New Solder Attach Technologies
Paper outlines a new technology with a focus on design and research ...
Next Generation PoP Pastes
This paper highlights some of the differences between traditional solder pastes and ...
The Digital Solder Paste
This paper discusses a process for creating a digital solder paste using ...
Flux Cored Wire Solder Shelf Life Study
Paper covers an investigation that a two year shelf life recommendation is ...
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny ...
Conformal Coating for Tin Whisker Management
The objective of this study is to evaluate conformal coatings for mitigation ...
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions ...
More Materials Tech  »
Great News If You Rework BGA Components
Great News If You Rework BGA Components
Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
CircuitMedic

Reliability of Multiple Pb-free Solder Ball Alloys
Reliability of Multiple Pb-free Solder Ball Alloys
Paper covers a screening experiment to obtain data comparing thermal fatigue reliability of the various solder ball alloys.
Authored By:
Joe Smetana, Richard Coyle, Peter Read
Alcatel-Lucent

Thomas Koshmeider, Freescale Semiconductor

Dave Love, Sun Microsystems

Mark Kolenik, Philips Medical

Jennifer Nguyen, Flextronics
This program first published August 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Comments  »
Use the form below to submit a comment.

No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Reliability of Multiple Pb-free Solder Ball Alloys

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits image
Featured Sponsors  »
Printing Focused on Useful Technology
Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America image
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits image
Pick & Place Industry's Best Warranty
Pick & Place Industry's Best Warranty
Does your equipment supplier stand behind the quality and reliability of their pick & place machines with a 5-year parts / 2-year labor warranty? Learn more...
Europlacer image
The Turnkey Assembly Specialist
The Turnkey Assembly Specialist
OEMs & contractors are reaping savings & benefits of in-house PCB assembly. Manncorp has expertise, support & wide range of equipment lines from $38,995 to $229,000 · TURNKEY INFO
Manncorp image
The Component Rework Experts
The Component Rework Experts
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
Circuit Technology Center image
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec image
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships