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Great News If You Rework BGA Components
Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
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Reliability of Multiple Pb-free Solder Ball Alloys
Paper covers a screening experiment to obtain data comparing thermal fatigue reliability of the various solder ball alloys.
Authored By:
Joe Smetana, Richard Coyle, Peter Read
Alcatel-Lucent
Thomas Koshmeider, Freescale Semiconductor
Dave Love, Sun Microsystems
Mark Kolenik, Philips Medical
Jennifer Nguyen, Flextronics
This program first published August 2010
Materials Tech programs cover topics including: Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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Printing Focused on Useful Technology
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