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February 9, 2012
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High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
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Why Switch From Pure DI-Water to Chemistry
Why Switch From Pure DI-Water to Chemistry
The purpose of this paper is to report a timely direct comparison between a pure DI-water process and a chemically assisted application.
Authored By:
Harald Wack, Ph.D., Umut Tosun
ZESTRON America

Joachim Becht Ph.D., Helmut Schweigart, Ph.D.
ZESTRON Europe
This program first published August 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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