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February 9, 2012
Cleaning Reballed BGA Components
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Rework for Lead-Free Mirrored BGA Designs
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6 Common Mistakes of BGA Rework
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Reworked BGA Bridging at the Corners
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Delamination Dilemma
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BGA Re-balling from Lead-free to Tin-lead
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Reworking Circuits Under a BGA Component
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Great News If You Rework BGA Components
Great News If You Rework BGA Components
Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
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Solder Paste Inspection During BGA Rework
Solder Paste Inspection During BGA Rework
When solder paste gets applied manually using a stencil, does it make sense to use an automatic inspection system to check solder paste height?
This program first published August 2010
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Expert Panel contributors for this topic:
Bill Coleman, Vice President Technology, Photo Stencil
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Dr. Craig D. Hillman, CEO & Managing Partner, DfR Solutions
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