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February 9, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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Cause of Pin Hole Rejects
Cause of Pin Hole Rejects
We have high rejects for pin holes on a particular SMT component after lead-free reflow. What is the likely cause of the problem?
This program first published August 2010
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Jim Williams, Chairman, Polyonics, Inc.
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