IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
 IPC OUTLOOK Logo
February 9, 2012
Related Programs  »
New Technologies for Ultra Thin Chips
Materials Tech
From the Single Chip to Wafer Integration
Materials Tech
Memory Minaturazation to Extend Moore's Law
Technology Briefing
Challenges of Package on Package Devices
Materials Tech
Gold Stud Bump Flip Chip Attachment
Materials Tech
Embedded Packaging Technologies
Materials Tech
Evaluation of POP Assembly Under Load
Production Floor
PCB Assembly for 3D Package-on-Package
Production Floor
Design for Flip-Chip and Chip-Size Technology
Materials Tech
Solder Bumping for Flip Chip Technology
Materials Tech
More Related Programs  »


Materials Tech  »
Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free ...
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected ...
New Technologies for Ultra Thin Chips
Paper shows different approaches to use ultra-thin chips for new packages with ...
Design of New Solder Attach Technologies
Paper outlines a new technology with a focus on design and research ...
Next Generation PoP Pastes
This paper highlights some of the differences between traditional solder pastes and ...
The Digital Solder Paste
This paper discusses a process for creating a digital solder paste using ...
Flux Cored Wire Solder Shelf Life Study
Paper covers an investigation that a two year shelf life recommendation is ...
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny ...
Conformal Coating for Tin Whisker Management
The objective of this study is to evaluate conformal coatings for mitigation ...
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions ...
More Materials Tech  » 		Can You Believe Pick-and-Place under $60,000?
Can You Believe Pick-and-Place under $60,000?
Manncorp's MC-385 pick-and-place mounts 01005 chips, micro-BGAs and fine-pitch QFPs.
Manncorp

Embedded Packaging Technologies
Embedded Packaging Technologies
Paper covers the design, packaging processes, and technology demonstrations of prototypes packaged using embedded technology.
Authored By:
Casey H. Cooper
STI Electronics, Inc.
Madison, AL USA
This program first published August 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Comments  »
Use the form below to submit a comment.
No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Embedded Packaging Technologies
The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
 Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits image
Featured Sponsors  »
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
 Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK image
Internationally Recognized Training
Internationally Recognized Training
 Train with the leading provider of IPC Certification, on-site or throughout US & Canada. Download the 2012 Schedule of all the IPC Programs...
EPTAC image
Printing Focused on Useful Technology
Printing Focused on Useful Technology
 EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America image
The Design Process Just Got Easier
The Design Process Just Got Easier
 Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits image
Pick & Place Industry's Best Warranty
Pick & Place Industry's Best Warranty
 Does your equipment supplier stand behind the quality and reliability of their pick & place machines with a 5-year parts / 2-year labor warranty? Learn more...
Europlacer image
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships