Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample. CircuitMedic
Addressing Head-In-Pillow Defects
The head-in-pillow defect has become a relatively common failure since the implementation of lead-free technologies. This paper addresses the three sources or contributing issues (supply, process & material) of head-in-pillow defects.
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime. Juki Automation Systems
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner. IPC — Association Connecting Electronics Industries
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
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