IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
 IPC OUTLOOK Logo
February 9, 2012
Related Programs  »
Hot Air Solder Leveling in the Lead-free Era
Materials Tech
Embedded Components: Analysis of Reliability
Analysis Lab
The Demise of the Plated-Through Hole?
Board Talk
Improve Etching Performance
Materials Tech
Removal of Oxidation from Bare PCBs
Board Talk
Poor Wetting On OSP Coated PCBs
Board Talk
Board Performance after Pb-Free Reflow
Materials Tech
Lead-free Board Materials Reliability Project
Materials Tech
Emerging Substrate Technologies
Materials Tech
Effect of Lead-Free on Key Material Properties
Materials Tech
More Related Programs  »


Materials Tech  »
Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free ...
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected ...
New Technologies for Ultra Thin Chips
Paper shows different approaches to use ultra-thin chips for new packages with ...
Design of New Solder Attach Technologies
Paper outlines a new technology with a focus on design and research ...
Next Generation PoP Pastes
This paper highlights some of the differences between traditional solder pastes and ...
The Digital Solder Paste
This paper discusses a process for creating a digital solder paste using ...
Flux Cored Wire Solder Shelf Life Study
Paper covers an investigation that a two year shelf life recommendation is ...
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny ...
Conformal Coating for Tin Whisker Management
The objective of this study is to evaluate conformal coatings for mitigation ...
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions ...
More Materials Tech  » 		Can You Believe Pick-and-Place under $60,000?
Can You Believe Pick-and-Place under $60,000?
Manncorp's MC-385 pick-and-place mounts 01005 chips, micro-BGAs and fine-pitch QFPs.
Manncorp

Effects of Solder Mask on Electro-Migration
Effects of Solder Mask on Electro-Migration
Paper presents results of temperature, humidity, bias testing for comparative evaluation of ECM on circuit boards with and without a solder mask.
Authored By:
Xiaofei He, Michael H. Azarian, Michael G. Pecht
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland, College Park, MD USA

Prognostics and Health Management Center
City University of Hong Kong, Kowloon, Hong Kong
This program first published August 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Comments  »
Use the form below to submit a comment.
No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Effects of Solder Mask on Electro-Migration
The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
 Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits image
Featured Sponsors  »
Do You Have Qualified Rework Technicians?
Do You Have Qualified Rework Technicians?
 Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center image
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
 Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec image
IPC Training & Certification from Blackfox
IPC Training & Certification from Blackfox
 Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
Blackfox Training Institute image
New High-speed Modular Chip-shooter
New High-speed Modular Chip-shooter
 The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems image
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
 Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
 Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships