IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 9, 2012
False Tin Whiskers: Masquerading Intermetallic
Analysis Lab
Cause of Unusual Contamination?
Ask the Experts
Addressing Head-In-Pillow Defects
Analysis Lab
What Causes Oxidation on SMT Pads?
Ask the Experts
The Effects of Flux Residues on Reliability
Analysis Lab
Head and Pillow SMT Failure Modes
Analysis Lab
Elimination of Whiskers from Electroplated Tin
Materials Tech
Fracture Prediction in Lead-Free Joints
Analysis Lab
Mysterious Solder Balls
Ask the Experts
Reducing Defects with Embedded Sensing
Materials Tech
More Related Programs  »



pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies ...
False Tin Whiskers: Masquerading Intermetallic
Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering ...
Reactions of Sn in the Cu-Sn-Zn Alloy
This paper reports a number of experimentally determined reactions that occur in ...
Embedded Components: Analysis of Reliability
Paper aims at analyzing and confirming the reliability performance of embedded components ...
Lead-free Reflow and Influence of Moisture
This paper examines concerns relating to lead-free reflow, PCB degradation, and the ...
Thermal Cycle Testing of PWBs
Paper establishes a test protocol for thermal cycle testing of bare PWBs ...
Void Detection in Solder Balls and Joints
Paper covers an automatic void detection algorithm. The method is applicable to ...
Addressing Head-In-Pillow Defects
The head-in-pillow defect has become a relatively common failure since the implementation ...
Thermal Shock/Drop Test of Lead-free
Paper has results from experimental research making a comparison of different lead-free ...
The Effects of Flux Residues on Reliability
Paper discusses an experiment designed to mimic partially activated flux residues under ...
More Analysis Lab  »
Great News If You Rework BGA Components
Great News If You Rework BGA Components
Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
CircuitMedic

Effect of Soldering and Flux on Whisker Growth
Effect of Soldering and Flux on Whisker Growth
This paper relates trends in whisker growth to observations of corrosion of solder as related to the type of flux used.
Authored By:
Keith Sweatman, Junya Masuda, Takashi Nozu, Masuo Koshi, Tetsuro Nishimura
Nihon Superior Co., Ltd, Osaka, Japan
This program first published August 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
Comments  »
Use the form below to submit a comment.

No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Effect of Soldering and Flux on Whisker Growth

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits image
Featured Sponsors  »
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK image
Internationally Recognized Training
Internationally Recognized Training
Train with the leading provider of IPC Certification, on-site or throughout US & Canada. Download the 2012 Schedule of all the IPC Programs...
EPTAC image
Printing Focused on Useful Technology
Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America image
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits image
Pick & Place Industry's Best Warranty
Pick & Place Industry's Best Warranty
Does your equipment supplier stand behind the quality and reliability of their pick & place machines with a 5-year parts / 2-year labor warranty? Learn more...
Europlacer image
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships