We are trying to reflow a PCB that contains both BGA and CSP's. We are seeing solder being sucked into vias. Is there a way to keep this from occurring?
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule... Blackfox Training Institute
The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market. Juki Automation Systems, Inc.
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
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