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February 9, 2012
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Voids In Leadless Packages
Voids In Leadless Packages
What is the primary cause of solder voiding in leadless packages such as BGA's?
This program first published July 2010
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Expert Panel contributors for this topic:
Peter Biocca, Senior Market Development Engineer, Kester
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Doug Dixon, Global Marketing Director, Henkel Electronics
Mike Scimeca, President, FCT Assembly
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