Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments» Use the form below to submit a comment.
I think there are several factors that may be at work here. There may be a cultural factor, which was eluded to in the piece. There may be a resource factor, not enough expertise to go around.
However, we shouldn't overlook the "continuous advance of component technology factor". As we become comfortable with 0402's, and micro-BGA's, here come 1005's, QFN's, and .075 pitch through hole arrays, etc, etc.
As component technology advances, a complete re-engineering of processes may be required to keep defects under control. So, at least from my perspective, the advance in component technology is the most critical factor promoting soldering defects today.
K.D., Zhone Technologies
I think it's companies who set themselves up to get mediocre results in manufacturing. They lean up their workforce so much that it's impossible for the engineering staff to manage it all.
I'm the Process Engineer for 5 SMT lines, which have 6 pick and place machines, 5 ovens, 5 printers. On top of that, I'm also the guy for our through hole dept which includes 4 selective soldering machines, component prep, wash, and hand soldering. I have an Engineer who is just now taking over the printing process and data collection for the SMT area, and an Engineering Tech who helps in both areas.
I have DFM projects constantly, ongoing process validation, new process investigation, RoHS, REACH, and a slew of other things like that that have my constant attention. Now, don't get me wrong, I know I have tremendous job security, but in reality, it's more work than 3 people can do so things slip.
We hit the major defects, not the spikes mind you, but the consistent, lower hanging fruit that does "weekly or daily" damage.
When I worked for HP (pre-Agilent), they had an Engineer and Tech for every SMT and Through Hole process. They might be an example of what having "Fat Engineering Resources" was, but defects were very low and continuous improvement was very obvious and focused on.
I think it boils down to the resources your company can commit, in other words: You get what you ultimately pay for.
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
SMD & through-hole types; others will tally 01005s. A must for inventory control, parts order checking or JIT production. From $389. MOTORIZED or MANUAL. Manncorp
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects. Circuit Technology Center
Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule... Blackfox Training Institute
The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market. Juki Automation Systems, Inc.
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
Use the form below to submit a comment.
However, we shouldn't overlook the "continuous advance of component technology factor". As we become comfortable with 0402's, and micro-BGA's, here come 1005's, QFN's, and .075 pitch through hole arrays, etc, etc.
As component technology advances, a complete re-engineering of processes may be required to keep defects under control. So, at least from my perspective, the advance in component technology is the most critical factor promoting soldering defects today.
K.D., Zhone Technologies
I'm the Process Engineer for 5 SMT lines, which have 6 pick and place machines, 5 ovens, 5 printers. On top of that, I'm also the guy for our through hole dept which includes 4 selective soldering machines, component prep, wash, and hand soldering. I have an Engineer who is just now taking over the printing process and data collection for the SMT area, and an Engineering Tech who helps in both areas.
I have DFM projects constantly, ongoing process validation, new process investigation, RoHS, REACH, and a slew of other things like that that have my constant attention. Now, don't get me wrong, I know I have tremendous job security, but in reality, it's more work than 3 people can do so things slip.
We hit the major defects, not the spikes mind you, but the consistent, lower hanging fruit that does "weekly or daily" damage.
When I worked for HP (pre-Agilent), they had an Engineer and Tech for every SMT and Through Hole process. They might be an example of what having "Fat Engineering Resources" was, but defects were very low and continuous improvement was very obvious and focused on.
I think it boils down to the resources your company can commit, in other words: You get what you ultimately pay for.
T.H.