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Solder Bumping for Flip Chip Technology
Paper presents new cost-efficient solder bumping and adapted assembly technologies for processing flip-chips.
Authored By:
Florian Schüßler
University Erlangen-Nuremberg
Institute for Manufacturing Automation and Production Systems
Erlangen, Germany
Rainer Dohle, Dr.-Ing.
Micro Systems Engineering GmbH
Berg, Germany
Thomas Oppert, Ghassem Azdasht
PAC TECH - Packaging Technologies GmbH
Nauen, Germany
Georgi Georgiev
KSG Leiterplatten GmbH
Gornsdorf, Germany
Jörg Franke
University Erlangen-Nuremberg
Institute for Manufacturing Automation and Production Systems
Erlangen, Germany
This program first published July 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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