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February 10, 2012
Hot Air Solder Leveling in the Lead-free Era
Materials Tech
Embedded Components: Analysis of Reliability
Analysis Lab
The Demise of the Plated-Through Hole?
Board Talk
Improve Etching Performance
Materials Tech
Removal of Oxidation from Bare PCBs
Board Talk
Poor Wetting On OSP Coated PCBs
Board Talk
Board Performance after Pb-Free Reflow
Materials Tech
Lead-free Board Materials Reliability Project
Materials Tech
Emerging Substrate Technologies
Materials Tech
Effect of Lead-Free on Key Material Properties
Materials Tech
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Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free ...
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected ...
New Technologies for Ultra Thin Chips
Paper shows different approaches to use ultra-thin chips for new packages with ...
Design of New Solder Attach Technologies
Paper outlines a new technology with a focus on design and research ...
Next Generation PoP Pastes
This paper highlights some of the differences between traditional solder pastes and ...
The Digital Solder Paste
This paper discusses a process for creating a digital solder paste using ...
Flux Cored Wire Solder Shelf Life Study
Paper covers an investigation that a two year shelf life recommendation is ...
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny ...
Conformal Coating for Tin Whisker Management
The objective of this study is to evaluate conformal coatings for mitigation ...
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions ...
More Materials Tech  »
PCBs are MSDs
PCBs are MSDs
IPC-1601 PCB Guidelines state, "board fabricators and users should strive to avoid baking by practicing effective handling, packaging, storage, and process controls..." Learn how ...
Super Dry®

Printable Materials for Electronic Packaging *
Printable Materials for Electronic Packaging *
This paper reports on novel printable materials that have the potential to surpass conventional materials.
Authored By:
Rabindra N. Das, How T. Lin, Jianzhuang Huang, John M. Lauffer
Frank D. Egitto, Mark D. Poliks, Voya R. Markovich
Endicott Interconnect Technologies, Inc.
Endicott, New York USA
This program first published July 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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IPC Member Spotlight  »
The Design Process Just Got Easier
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Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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Featured Sponsors  »
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Pick & Place Industry's Best Warranty
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Compact Reflow Oven with KIC
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Space-saving 6 1/2 ft. long, 16" pin conveyor over 20" mesh belt. Computer-controlled, four convection heat zones, lead-free. Includes KIC "Auto Focus Power". $22,995 · CR-4000C INFO
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MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
Printing Focused on Useful Technology
Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America
The Component Rework Experts
The Component Rework Experts
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
Circuit Technology Center
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
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