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February 3, 2012
Rework for Lead-Free Mirrored BGA Designs
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BGA Re-balling from Lead-free to Tin-lead
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Reworking Circuits Under a BGA Component
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PCB Protection Overview
PCB Protection Overview
Henkel's circuit board protection include, conformal coating, encapsulants, potting, module sealing and low pressure molding.
Henkel Electronics

Dip Solder Paste for BGA Rework
Dip Solder Paste for BGA Rework
Paper examines the process feasibility and reliability of using dippable solder paste for area array component rework and repair.
Authored By:
David Hillman, Douglas Pauls, Andrew Steinmetz
Rockwell Collins, Cedar Rapids, Iowa USA
This program first published July 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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Lead-free Compatible Selective Soldering
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The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
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New Standards in Dispensing Technology
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IPC Training & Certification from Blackfox
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APEX EXPO® Keynote William Shatner
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Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
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Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
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Multicore TFN700B is a no-clean, halide-free tacky flux formulated to address the challenging requirements of package-on-package applications.
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