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February 10, 2012
Thermal Cycle Testing of PWBs
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Void Detection in Solder Balls and Joints
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Ideas for Identifying Counterfeit Components
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Flexible Fixturing System for In-Circuit Test
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NASA Lead-Free Project: Mechanical Shock Test
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Printing Focused on Useful Technology
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EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
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Void Detection in Solder Balls and Joints
Void Detection in Solder Balls and Joints
Paper covers an automatic void detection algorithm. The method is applicable to pre SMT solder balls or post SMT solder joints.
Authored By:
Asaad F. Said, Lina J. Karam
School of Electrical, Computer, & Energy Engineering
Arizona State University, Tempe, AZ, USA

Bonnie L. Bennett, Jeff Pettinato
Intel Corporation, USA
This program first published July 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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