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Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America
Void Detection in Solder Balls and Joints
Paper covers an automatic void detection algorithm. The method is applicable to pre SMT solder balls or post SMT solder joints.
Authored By:
Asaad F. Said, Lina J. Karam
School of Electrical, Computer, & Energy Engineering
Arizona State University, Tempe, AZ, USA
Bonnie L. Bennett, Jeff Pettinato
Intel Corporation, USA
This program first published July 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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Today's Sponsor
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IPC Member Spotlight »
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
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Featured Sponsors »
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APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
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Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic 
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Flux and Under-fill in a Single Material
This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
Henkel Corporation
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Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
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