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February 9, 2012
Cleaning Reballed BGA Components
Board Talk
Rework for Lead-Free Mirrored BGA Designs
Production Floor
Is Pre-Bake Required Prior to Rework?
Ask the Experts
BGA Replacement Limit
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6 Common Mistakes of BGA Rework
Production Floor
Can You Rework Circuits Under a BGA
Ask the Experts
Reworked BGA Bridging at the Corners
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Delamination Dilemma
Ask the Experts
BGA Re-balling from Lead-free to Tin-lead
Production Floor
Reworking Circuits Under a BGA Component
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Can We Skip Cleaning After Rework?
Can We Skip Cleaning After Rework?
What short-term and long-term concerns should we have with product reliability if we skip cleaning after rework?
This program first published June 2010
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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