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February 9, 2012
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Head and Pillow SMT Failure Modes
Head and Pillow SMT Failure Modes
This paper describes critical factors affecting head and pillow and how to identify the root cause and give potential solutions to prevent the defect.
Authored By:
Dudi Amir, Raiyo Aspandiar, Scott Buttars, Wei Wei Chin, Paramjeet Gill
Intel Corporation, Hillsboro, OR, USA
Kulim, Kedah, Malaysia
This program first published June 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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