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February 9, 2012
Cleaning Reballed BGA Components
Board Talk
Rework for Lead-Free Mirrored BGA Designs
Production Floor
Is Pre-Bake Required Prior to Rework?
Ask the Experts
BGA Replacement Limit
Ask the Experts
6 Common Mistakes of BGA Rework
Production Floor
Can You Rework Circuits Under a BGA
Ask the Experts
Reworked BGA Bridging at the Corners
Ask the Experts
Delamination Dilemma
Ask the Experts
BGA Re-balling from Lead-free to Tin-lead
Production Floor
Reworking Circuits Under a BGA Component
Ask the Experts
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Overcoming Repair Depot Challenges
Overcoming Repair Depot Challenges
This paper looks at key issues that should be considered in developing a robust outsourced repair depot strategy.
Authored By:
Greg Bannick
Kimball Electronics Group
Jasper, IN USA
This program first published June 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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IPC Training & Certification from Blackfox
IPC Training & Certification from Blackfox
Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
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MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
MSD Damage Causes Early Field Failures
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Flux and Under-fill in a Single Material
Flux and Under-fill in a Single Material
This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
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Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
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