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February 3, 2012
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Imbedded Components: Ready for Mainstream?
Imbedded Components: Ready for Mainstream?
Paper discusses the design methodology, and validation/test data gathered during the implementation of IC/DT in a mixed signal prototype.
Authored By:
Casey H. Cooper, Mark T. McMeen, Jim D. Raby
STI Electronics, Inc., Madison, AL USA
This program first published June 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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