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Edgebond Adhesive Reinforces BGAs & VGAs
Dymax 9309-SC light-cure adhesive, for rapid ruggedization of PCB critical components, has See-Cure technology for cure confirmation. Request a sample.
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Advances in Monitoring of Stencil Printing
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
The electronics assembly industry has long wished for and made great advancements toward developing a true, closed-loop automatic print verification and process monitoring technology. While significant progress has been made, many hurdles remain to be overcome. Recent developments in on-board inspection technology, however, have pushed the "lights-out" printing concept even closer to becoming reality.
This paper will present data on a novel print verification technology that uses a series of sensors to capture the full board image, analyze the data and accept or reject the print - all in real time. The system compares the actual print to that of the PCB‟s Gerber data to assess accuracy and paste presence/absence, among other print components, and can be integrated with additional machine performance tools to make the printing platform even more intuitive. By enabling the print and inspection processes to run concurrently and deliver 100% verification at full line speed, production rates can be maintained and throughput is exponentially improved. The technology can have a profound impact on cost reduction, as faulty boards are isolated and removed from the line at the printing phase instead of traveling fully downstream to final assembly. Additionally, integrating such high-speed and powerful inspection technology onto the printing system eliminates the requirement for a dedicated, in-line SPI machine, and saves even more resource including training and floor space.
The inspection component of this next-generation technology can also be combined with verification and traceability tools to confirm all print inputs and outputs and trace materials, boards and processes to origination. This is a requirement for many high-value applications such as medical, defense and aerospace and has tremendous benefit for traditional EMS and OEM assembly operations as well.
|Stencil Cleaner Recommended for Durostone Pallets
Permali, makers of Durostone Pallet material, has tested Smart Sonic's ultrasonic stencil cleaners and 440-R SMT Detergent and recommends Smart Sonic for cleaning Durostone pallets.
Smart Sonic Corporation
|87 Repair/Rework Guides - Illustrated and Online
This free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies.
Circuit Technology Center
|Pick & Place Machine's Integrated Intelligence
The award winning iineo-II is highly regarded as the most productive, multi-functional assembler for high-mix environments in the PCB assembly industry. Learn more...
Europlacer North America
|10% Off for IPC Members!
IPC members receive a 10% discount on all IPC Certification Programs when training with EPTAC. So sign up today with the market leader.
|Smart Thermal Profiling
Proper measurements and robust data collection = superb, repeatable thermal processes. Make the intelligent choice with SuperM.O.L.E.® Gold 2.