Solder Creep Fatigue for Lead-Free Joints

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Solder Creep Fatigue for Lead-Free Joints

Paper covers parameters for the SAC405 / 305, SAC205, SAC105 and SnAg to replace parameters for eutectic SnPb in the Engelmaier-Wild solder creep-fatigue model.

Program: Analysis Lab
Channel: Test, Inspection, X-Ray

Authored By:
Werner Engelmaier
Engelmaier Associates, L.C., Ormond Beach, FL USA

This program first published June 2010

Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

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