IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 3, 2012
Rework for Lead-Free Mirrored BGA Designs
Production Floor
Is Pre-Bake Required Prior to Rework?
Ask the Experts
BGA Replacement Limit
Ask the Experts
6 Common Mistakes of BGA Rework
Production Floor
Can You Rework Circuits Under a BGA
Ask the Experts
Reworked BGA Bridging at the Corners
Ask the Experts
Delamination Dilemma
Ask the Experts
BGA Re-balling from Lead-free to Tin-lead
Production Floor
Reworking Circuits Under a BGA Component
Ask the Experts
Jumper Wire Nightmare
Production Floor
More Related Programs  »



Problems Hand Soldering 24 Layer Board
We are assembling a back plane board with 24 layers. We are ...
Component Damage From IR Reflow
We have an SMT package with J formed leads that crack at ...
Organic Flux Residue Concerns
What concerns should we have with reliability if we skip cleaning after ...
Alternatives to Conformal Coating
What are conformal coating alternatives to insulate solder joints and exposed conductors ...
Does Lead-free Flux Make a Difference?
Does using a lead-free solder flux really make a difference? Why not ...
Cause of Unusual Contamination?
We have 40 PCB assemblies with unusual contamination. Do you have any ...
Wave Soldering Problems
We are seeing many process defects that occur after wave soldering operations. ...
Is Pre-Bake Required Prior to Rework?
On occasion we need to perform rework. Is there a standard that ...
BGA Replacement Limit
How many times can a BGA component be replaced at the same ...
Recovering Solder from Dross
Does it make economic sense to develop an in-house capability for recovering ...
More Ask the Experts  »
Highly Flexible Pick-Place with 8-axis Placer
Highly Flexible Pick-Place with 8-axis Placer
Cobra is the first inline machine to combine the advantages of a highly flexible pick-and-place with the speed of an 8-axis placer.
Essemtec

Reworked BGA Bridging at the Corners
Reworked BGA Bridging at the Corners
Recently reworked BGA components are bridged at the corners. What caused the corners of the BGA component to bridge and how can we prevent it?
This program first published June 2010
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

Ask the Experts Questions | Ask the Experts Panel
Submit A Questions | Join the Panel
Expert Panel contributors for this topic:
Don Naugler, General Manager, VJ Technologies, Inc.
Rodney Miller, Capital Equipment Operations Manager, SCS Coatings
Mitch DeCaire, Sales Manager (Americas), Cogiscan, Inc.
Mark McMeen, VP Engineering Services, STI Electronics Inc.
Al Cabral, Product Development Manager, VJ Technologies, Inc.
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Neil O'Brien, Sales Director, Finetech
Comments  »
Use the form below to submit a comment.

No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Reworked BGA Bridging at the Corners

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
New High-speed Modular Chip-shooter
New High-speed Modular Chip-shooter
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems
Featured Sponsors  »
Fully Automatic Inline Stencil Printer
Fully Automatic Inline Stencil Printer
Tucano is a high-precision, automatic inline printer with exceptional alignment repeatability and quick change over on a small footprint.
Essemtec
IPC Training & Certification from Blackfox
IPC Training & Certification from Blackfox
Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
Blackfox Training Institute
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec
APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
Online PCB Repair Guidebook
Online PCB Repair Guidebook
Our guidebook should be helpful to anyone who works with bare boards and board assemblies. Dozens of procedures packed with illustrations.
Circuit Technology Center
Innovative No-clean, Halide-free Tacky Flux
Innovative No-clean, Halide-free Tacky Flux
Multicore TFN700B is a no-clean, halide-free tacky flux formulated to address the challenging requirements of package-on-package applications.
Henkel Corporation
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships