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February 9, 2012
Cleaning Reballed BGA Components
Board Talk
Rework for Lead-Free Mirrored BGA Designs
Production Floor
Is Pre-Bake Required Prior to Rework?
Ask the Experts
BGA Replacement Limit
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6 Common Mistakes of BGA Rework
Production Floor
Can You Rework Circuits Under a BGA
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Reworked BGA Bridging at the Corners
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Delamination Dilemma
Ask the Experts
BGA Re-balling from Lead-free to Tin-lead
Production Floor
Reworking Circuits Under a BGA Component
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Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
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Small Chip Cap Rework Advise
Small Chip Cap Rework Advise
What are the best tools and techniques you suggest for rework of small components such as 0201 and 0402 chip caps?
This program first published June 2010
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Al Cabral, Product Development Manager, VJ Technologies, Inc.
Neil O'Brien, Sales Director, Finetech
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