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February 9, 2012
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More Production Floor  » 		Great News If You Rework BGA Components
Great News If You Rework BGA Components
Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
CircuitMedic

Cleanliness of Stencils and Misprinted Boards
Cleanliness of Stencils and Misprinted Boards
Paper covers the effectiveness of cleaning stencils and misprinted/dirty printed circuit boards and checking to see if they have stayed clean.
Authored By:
Bev Christian
Research In Motion
Waterloo, Ontario, Canada
This program first published June 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
 Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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IPC Training & Certification from Blackfox
IPC Training & Certification from Blackfox
 Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
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Lead-free Compatible Selective Soldering
Lead-free Compatible Selective Soldering
 The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
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MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
 Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
 Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
Flux and Under-fill in a Single Material
Flux and Under-fill in a Single Material
 This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
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Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
 Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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