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February 9, 2012
False Tin Whiskers: Masquerading Intermetallic
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False Tin Whiskers: Masquerading Intermetallic
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False Tin Whiskers: Masquerading Intermetallic
False Tin Whiskers: Masquerading Intermetallic
Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering details during root cause analysis.
Authored By:
David Hillman
Rockwell Collins Inc.
Cedar Rapids, IA, USA
This program first published June 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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