A Robust Fine Feature Printing Process

The Knowledge and Know-how Connection

February 9, 2012

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IPC Association Connecting Electronics Industries

A Robust Fine Feature Printing Process

This paper evaluates many fine printing stencil factors that have an increased effect on the transfer efficiency of solder pastes.

Program: Production Floor
Channel: Assembly, Printing, Pick & Place

Authored By:
George Babka
Assembleon America, Inc., Alpharetta, GA, USA

David Sbiroli and Chris Anglin
Indium Corporation, Clinton, NY, USA

Richard Brooks
Christopher Associates, Kyle, TX, USA

This program first published June 2010

Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

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