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February 9, 2012
Energy & Ecology: Turning Negative to Positive
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Recovering Solder from Dross
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Pb-Free Electronics Risk Mitigation
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Soldering Lead-free with Tin-lead Solder
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RoHS War Stories
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Preparing Supply Chains for Green Transitions
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Implementing Halogen-Free PCB Assembly
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Design for Low-Halogen Green Electronics
Materials Tech
Coping in a Lead-free World
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ESD Protection
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Mixing Tin-lead and Lead-free
Mixing Tin-lead and Lead-free
What are the risks of mixing tin-lead and lead-free components on a board that does not have to be RoHS compliant?
This program first published June 2010
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  »
Use the form below to submit a comment.
The main concern is a Pb free BGA in reflow at a leaded temperature profile which may cause defects such as voids or cracks. Pretty much all other components can be mixed with lead solder paste and a leaded profile used.

Robert Morales, Eastman Kodak
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Mixing Tin-lead and Lead-free

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MSD Damage Causes Early Field Failures
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Super Dry®
MSD Damage Causes Early Field Failures
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