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February 9, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Paper covers best practices for optimizing the reflow process to meet challenges of higher temperatures, smaller deposits and decreased powder size.
Authored By:
Ed Briggs
Indium Corporation, Clinton, NY, USA

Ron Lasky, Ph.D., PE
Indium Corporation and Dartmouth College
This program first published June 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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MSD Damage Causes Early Field Failures
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APEX EXPO® Keynote William Shatner
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