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February 9, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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SMT Component Shift
SMT Component Shift
What is the reason and the solution for the component shift we are experiencing during reflow?
This program first published June 2010
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Greg York, Technical Sales Manager, BLT Circuit Services Ltd
Richard Burke, National Sales Manager, Datapaq
John Vivari, Application Engineering Supervisor, Nordson EFD
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Brian O'Leary, General Manager of International Sales, KIC
Fred Dimock, Manager, Process Technology, BTU International
Marc Peo, President, Heller Industries Inc.
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