IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 9, 2012
pH Neutral vs. Alkaline Cleaning Agents
Analysis Lab
Ultrasonic Cleaning Causing Damage
Ask the Experts
Removing Flux from Low Standoff Heights
Production Floor
Organic Flux Residue Concerns
Ask the Experts
Is Baking Required After Water Cleaning?
Board Talk
How Clean is Clean?
Production Floor
Cleaning No-Clean Solder Paste
Ask the Experts
Collaborative Cleaning Process Innovations
Production Floor
Why Switch From Pure DI-Water to Chemistry
Production Floor
Effects of Ultrasonic Cleaning
Ask the Experts
More Related Programs  »



Removing Flux from Low Standoff Heights
Paper covers evaluation of cleaning effectiveness of chemistries in removing flux residues ...
Nitrogen Inerting For Lead-Free Wave Soldering
This paper presents a new generation N2 inerting system for wave soldering ...
Rework for Lead-Free Mirrored BGA Designs
Paper covers recommended materials and the hot gas rework process for lead-free ...
Four Techniques for Removing Solder Mask
This program explains four techniques for removing solder mask including grinding, milling, ...
Going Lead Free with Vapor Phase Soldering
Many companies have not found the right solutions to change over to ...
Past, Present, Future of Solderless Assembly
Paper examines some of the solderless assembly methods used over the years, ...
Optimization to Prevent the Graping Effect
This paper will discuss the specific challenge of the Graping Effect and ...
Stencil Manufacturing and Impact on Precision
Stencil positional accuracy is a function of the manufacturing process. This paper ...
A Robust Fine Feature Printing Process
This paper evaluates many fine printing stencil factors that have an increased ...
6 Common Mistakes of BGA Rework
Ball Grid Array rework is one of the most challenging procedures performed ...
More Production Floor  »
New Standards in Dispensing Technology
New Standards in Dispensing Technology
The new Scorpion can dispense up to 100,000 dots per hour. The ideal dispensing system for flexible and productive dispensing.
Essemtec

Selecting Cleaning Processes for Defluxing
Selecting Cleaning Processes for Defluxing
This paper discusses the factors, advantages and disadvantages to consider for commonly used cleaning processes.
Authored By:
Michael C. Savidakis, Ph.D., Jay Soma, Ph.D., Robert Sell, Christine Fouts, Ph.D.
Petroferm Inc., Gurnee, Illinois USA
This program first published June 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
Comments  »
Use the form below to submit a comment.

No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Selecting Cleaning Processes for Defluxing

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits image
Featured Sponsors  »
APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic image
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK image
Internationally Recognized Training
Internationally Recognized Training
Train with the leading provider of IPC Certification, on-site or throughout US & Canada. Download the 2012 Schedule of all the IPC Programs...
EPTAC image
Printing Focused on Useful Technology
Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America image
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships