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February 3, 2012
Embedded Components: Analysis of Reliability
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The Demise of the Plated-Through Hole?
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Improve Etching Performance
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Removal of Oxidation from Bare PCBs
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Poor Wetting On OSP Coated PCBs
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Board Performance after Pb-Free Reflow
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Lead-free Board Materials Reliability Project
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Emerging Substrate Technologies
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Effect of Lead-Free on Key Material Properties
Materials Tech
Understanding Surface Insulation Resistance
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Printing Focused on Useful Technology
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Inkjet Printing for Electronic Circuits
Inkjet Printing for Electronic Circuits
This paper explores the promise of what inkjet printing can bring to process simplification, cost reduction and improved capabilities.
Authored By:
Brian Amos
Engineering Manager
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Thomas Sutter
Emerging Technologies R&D
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This program first published June 2010
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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New High-speed Modular Chip-shooter
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IPC Training & Certification from Blackfox
IPC Training & Certification from Blackfox
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APEX EXPO® Keynote William Shatner
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The Component Rework Experts
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