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February 9, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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BGA Shifting During Reflow
BGA Shifting During Reflow
We have a BGA component that is shifting during inline reflow. What could likely be the cause of the BGA shifting?
This program first published June 2010
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Sandip Thakor, Quality Engineer, Matrix Telecom Solution P Ltd
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Steven Adamson, Market Specialist, Nordson ASYMTEK
Stephanie Henninger, Director, Integrated Ideas & Technologies, Inc.
Al Cabral, Product Development Manager, VJ Technologies, Inc.
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MSD Damage Causes Early Field Failures
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