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February 10, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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What Is the Life Span for a Profile Board?
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How many times can I use one test board to profile our reflow oven before throwing it away, and why?
This program first published June 2010
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Mark Waterman, Engineer / Trainer, Electronic Controls Design, Inc. (ECD)
Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
Al Cabral, Product Development Manager, VJ Technologies, Inc.
Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
Brian O'Leary, General Manager of International Sales, KIC
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