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Effects of Reflow and Flux on Tin Whiskers
Paper covers tin whisker formation on solders fillets of QFPs with 3 different concentrations of HBr activated fluxes.
Authored By:
Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma
Institute of Scientific and Industrial Research, Osaka University, Osaka, Japan
Sharon Huang, Benjamin Jurcik, and Shigeyoshi Nozawa
Air Liquide Laboratories, Tsukuba, Ibaraki, Japan
Bryan Stone
Air Liquide Industrial U.S. LP, Santa Fe Springs, CA, USA
Minoru Ueshima
Senju Metal Industry Co., Tokyo, Japan
This program first published June 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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