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June 18, 2013
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
Analysis Lab
White Discoloration After Ultrasonic Cleaning
White Discoloration After Ultrasonic Cleaning
Ask the Experts
Results with Benchtop PCB Cleaning
Results with Benchtop PCB Cleaning
Production Floor
Oscillating Nozzles for Improved Cleaning
Oscillating Nozzles for Improved Cleaning
Production Floor
Collaborative Cleaning Innovations
Collaborative Cleaning Innovations
Production Floor
Cleaning Conformal Coating After Rework
Cleaning Conformal Coating After Rework
Ask the Experts
Proper DI Water Resistivity for PCB Cleaning?
Proper DI Water Resistivity for PCB Cleaning?
Ask the Experts
Can Water Harm Electronic Components?
Can Water Harm Electronic Components?
Board Talk
Cleaning to Enhance Product Reliability
Cleaning to Enhance Product Reliability
Production Floor
Mixed Cleaning - No Clean and Water Soluble
Mixed Cleaning - No Clean and Water Soluble
Board Talk
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Surface Mount and BGA Pad Repair... Really?
Surface Mount and BGA Pad Repair... Really?
Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how we can do it reliably.
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Cleaning to Remove Solder Balls
Cleaning to Remove Solder Balls
What is the best board cleaning method for removing solder balls from PCBs? It has been suggested that we use a "spray in air system," as the only sure method.
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Umut Tosun, Application Technology Manager, Zestron America
Bill Schreiber, President, Smart Sonic Corporation
Mike Konrad, President, Aqueous Technologies
John Norton, Eastern Manager, Vitronics Soltec
Terry Munson, President/Senior Technical Consultant, Foresite
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Steve Stach, President, Austin American Technology
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